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LS-NUN
Laser Depaneling System
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Use various Laser source as UV, Green, IR, etc.
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Cutting materials : FR4, FPCBs, Kapton, etc.
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Thickness up to 1.2mm in the case of FR4 PCB
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Pin Table, Production fixture
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Full-cut process, Support high populated PCB panel
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Best cutting quality(Minimize charring)
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Clean process of particle and fume removal
Features
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Easy setup of BDS(Beam Delivery System)
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Automated Laser power management
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Apply the optimized optic system
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Incredible cost performance using 2 Table
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Full graphic interface and easy programming
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Real-time monitoring of key process parameters
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